Products>Semiconductor |
A substrate pattern will be designed quickly and for a low cost. | ||||
1. | CAD used: PowerPCB | |||
2. | Required documents: Circuit plan, bill of materials, planned outside form of substrate, design requirements, product information, net list | |||
3. | Maximum substrate size: 1,397mm x 1,397mm | |||
4. | Maximum number of layers: 30 (with boards of 1.6mm thickness, maximum of 8) | |||
5. | Able to build with multiple layers on a single side. Also able to produce dual sided substrate chips. | |||